1、Bidding Conditions
Overview:Mold Chase
Source of Funds:Prepared
Description of The Prepared Bidding Conditions:Prepared
2、Bidding Content
Bidding No:0664-1940SUMECB55
Project Name:Mold Chase
Place of Implementation:Qingdao
List of Products:
NO. | Product Name | Quantity | Main Technical Data | Remarks |
Mold Chase | 2 | More details in the Chinese version of the tendering document |
3、Qualification Requirements For Bidder
Qualifications or Performance:More details in the Chinese version of the tendering document
Joint Bids:NOT Available
Bid without the bidding documents:NOT Available
4、Acquisition of Bidding Documents
Beginning of Selling Bidding Documents:2019-05-24
Ending of Selling Bidding Documents:2019-05-31
Sell bidding?doc?online?or?not:No
To Obtain::On-site Purchase
Place:SUMEC INTERNATIONAL TECHNOLOGY CO., LTD. International Tendering Center. (9th floor of SUMEC Building)
Price of Bidding Documents:¥¥300/$45/$45
5、Bid Submission
Deadline for Submitting Bids/Time of Bid Opening (Beijing Time):2019-06-14 10:00
Place of Bid:Room 311 OF SUMEC Building
Place of Bid Opening:Room 311 OF SUMEC Building
6、The bidder needs to register before the tender on www.chinabidding.com. And the evaluation results will be released on www.chinabidding.com.
7、Contact Details
Purchasers:Qingdao tairuisi microelectronics co. LTD
Add.:Qingdao
Contact:MR DAI
Tel:15050581703
Bidding Agency:SUMEC INTERNATIONAL TECHNOLOGY CO., LTD.
Add.:198 Changjiang Road, Nanjing, China
Contact:SHIJIAOJIE
Tel:025-84531584
8、Remittance Approach:
Bank(RMB):
Bank(USD):
Account NO.(RMB):
Account NO.(USD):