Project Name:Wafer cutting machine
Bidding NO :0664-2440SUMECA74/07
Bidding Content:Wafer cutting machine
Bidding Agency:SUMEC INTERNATIONAL TECHNOLOGY CO., LTD.
Purchasers:Beijing Xinli Technology Innovation Center Co., Ltd.
Open-Time of Bids:2024-04-11 10:00
Data of Evaluation Result:2024-04-12 20:18 - 2024-04-15 23:59
Data of Bidding Result:2024-04-16 17:16
Final-Winner:Teltec Semiconductor Pacific Limited
Manufacturer:Suzhou Delphilaser Co.,Ltd.
Manufacturer Country:China