1、Bidding Conditions
Overview:Defect detector machines
Source of Funds:Prepared
Description of The Prepared Bidding Conditions:Prepared
2、Bidding Content
Bidding No:0664-2440SUMECF18/05
Project Name:Defect detector machines for 8-inch MEMS wafer production lines
Place of Implementation:Bengbu city
List of Products:
| NO. | Product Name | Quantity | Main Technical Data | Remarks |
| 1 | Defect detector | 1 | Please refer to the bidding documents for details |
3、Qualification Requirements For Bidder
Qualifications or Performance:More details in the Chinese version of the tendering document
Joint Bids:NOT Available
Bid without the bidding documents:NOT Available
4、Acquisition of Bidding Documents
Beginning of Selling Bidding Documents:2024-04-19
Ending of Selling Bidding Documents:2024-04-26
Sell bidding？doc？online？or？not:No
To Obtain::On-site Purchase
Place:More details in the Chinese version of the tendering document
Price of Bidding Documents:￥3000/$400
5、Bid Submission
Deadline for Submitting Bids/Time of Bid Opening (Beijing Time):2024-05-13 10:00
Place of Bid:More details in the Chinese version of the tendering document
Place of Bid Opening:More details in the Chinese version of the tendering document
6、The bidder needs to register before the tender on www.chinabidding.com. And the evaluation results will be released on www.chinabidding.com.
7、Contact Details
Purchasers:Anhui Huaxin Weina Integrated Circuit Co., Ltd.
Add.:Bengbu city
Contact:Mr Chen
Tel:13906020315
Bidding Agency:SUMEC INTERNATIONAL TECHNOLOGY CO., LTD.
Add.:Nanjing city
Contact:Mr Jiang/Ms Zhu/Ms Zhou
Tel:18551719296、025-84531056
8、Remittance Approach:
Bank(RMB):
Bank(USD):
Account NO.(RMB):
Account NO.(USD):
