Bidding NO :1447-254080568W97
Bidding Content:Intelligent photonic device packaging and testing platform
Bidding Agency:Shanghai Jiansheng Educ,Equip Tender Co Ltd.
Purchasers:Shanghai University
Open-Time of Bids:2025-09-16 13:30
Ending Date of Evaluation Result:2025-09-22 23:59
Who proposed the successful bidder:
| rank | Proposed Bid-winner | Manufacturer | Manufacturer Country |
|---|---|---|---|
| 1 | Kush Technologies Company Limited | Fujikura Ltd. | Japan |
| 2 | Shanghai Cifei Technology Co., Ltd | Shanghai Cifei Technology Co., Ltd | China |
| 3 | TIANSHENG INTERNATIONAL(HONG KONG) TECHNOLOGY LIMITED | TIANSHENG INTERNATIONAL(HONG KONG) TECHNOLOGY LIMITED | China Hongkong |
