Bidding NO :0613-254025125158
Bidding Content:Fully automatic wafer laser cutting machine
Bidding Agency:Shanghai Machinery & Electric Equipment Tendering Co.,Ltd.
Purchasers:Shanghai INESA Intelligent Electronics Co., Ltd
Open-Time of Bids:2025-10-31 09:30
Ending Date of Evaluation Result:2025-11-06 23:59
Who proposed the successful bidder:
| rank | Proposed Bid-winner | Manufacturer | Manufacturer Country |
|---|---|---|---|
| 1 | Suzhou SLD Electronic Co.,Ltd. | DISCO CORPORATION | Japan |
