Project Name:Shanghai INESA Intelligent Electronics Co., Ltd Fully automatic wafer laser cutting machine
Bidding NO :0613-254025125158
Bidding Content:Fully automatic wafer laser cutting machine
Bidding Agency:Shanghai Machinery & Electric Equipment Tendering Co.,Ltd.
Purchasers:Shanghai INESA Intelligent Electronics Co., Ltd
Open-Time of Bids:2025-10-31 09:30
Data of Evaluation Result:2025-11-03 16:50 - 2025-11-06 23:59
Data of Bidding Result:2025-11-07 16:29
Final-Winner:Suzhou SLD Electronic Co.,Ltd.
Manufacturer:DISCO CORPORATION
Manufacturer Country:Japan