Huacai Tendering Group entrusted by the purchaser, invites sealed bids from eligible suppliers home and abroad for the supply of the following goods and/or service by way of International Competitive Bidding. The tender notice was released on www.chinabidding.com on2026-03-04
1、Bidding Conditions
Overview:Procurement of Overlay Metrology Equipment for the High-Voltage and High-Power Chip Capacity Improvement Project of Yandong Co., Ltd.
Source of Funds:Implemented
Description of The Prepared Bidding Conditions:Already equipped
2、Bidding Content
Bidding No:1289-264026ZB0138
Project Name:Procurement of Overlay Metrology Equipment for the High-Voltage and High-Power Chip Capacity Improvement Project of Yandong Co., Ltd.
Place of Implementation:Beijing China
List of Products:
| NO. | Product Name | Quantity | Main Technical Data | Remarks |
| 1 | SIC set measuring instrument | One unit | To achieve the overlay measurement process in the manufacturing flow of 6-inch or 8-inch silicon-based and silicon carbide substrate wafers for semiconductor integrated circuits. |
3、Qualification Requirements For Bidder
Qualifications or Performance:1. The bidder or its manufacturer must possess the capability to produce the set of measuring instruments for this tender. The manufacturer must also provide effective after-sales service for these instruments (including the service provider and contact details for Yan Dong).
2. The manufacturer of the bidder shall provide sales records of 10 or more units of relevant or similar equipment for the past three years (from January 1, 2023 to the present). A copy of the supply list, order, or contract, stamped with the company seal or signed by an authorized representative, must be submitted. If only the supply list is provided, a letter of commitment bearing the company seal is required to verify the authenticity of the content.
3. The bidding product should be the bidder's or its manufacturer's own technical product. The bidding product may involve relevant patent content, and the bidder shall ensure that the tenderer is not held responsible for identifying and infringing on these patents.
4. The target equipment must be newly manufactured equipment, please provide a "commitment letter".
5. Original or photocopy of the credit certificate issued by the bidder's bank within three months prior to the bid opening date (with the bidder's company seal affixed to the photocopy);
6. Other qualification certification documents required in the bidding documents.
Joint Bids:NOT Available
Bid without the bidding documents:NOT Available
4、Acquisition of Bidding Documents
Beginning of Selling Bidding Documents:2026-02-28
Ending of Selling Bidding Documents:2026-03-06
Sell bidding？doc？online？or？not:No
To Obtain::On-site Purchase
Place:Room 1601, Building 6, Guotou Wealth Plaza, No. 9 Guang'an Road, Fengtai District, Beijing
Price of Bidding Documents:￥800/$115
5、Bid Submission
Deadline for Submitting Bids/Time of Bid Opening (Beijing Time):2026-03-23 10:00
Place of Bid:Huacai Tendering Group Co., Ltd. 1st Conference Room, 15th Floor, Building 6, Guotou Wealth Plaza, No. 9 Guang'an Road, Fengtai District, Beijing
Place of Bid Opening:Huacai Tendering Group Co., Ltd. 1st Conference Room, 15th Floor, Building 6, Guotou Wealth Plaza, No. 9 Guang'an Road, Fengtai District, Beijing
6、Contact Details
Purchasers:Beijing Yan Dong Microelectronic Co., Ltd
Add.:51 Jinghai Fourth Road, Beijing Economic and Technological Development Zone
Contact:Mr. Wang Yu
Tel:+86-10-50973000-8107
Bidding Agency:Huacai Tendering Group
Add.:Room 1601, Building 6, Guotou Wealth Plaza, No. 9 Guang'an Road, Fengtai District, Beijing
Contact:Ms. Jia Dongmin
Tel:010-63509799-8013/8029
7、Remittance Approach:
Bank(RMB):
Bank(USD):
Account NO.(RMB):
Account NO.(USD):
