Bidding NO :0618-264TC26070AH
Bidding Content:On semiconductor manufacturing and advanced packaging production lines, wafer film mounters are applied to attach thermal release films, surface protective films and other thin films. Compatible with 12-inch wafers and chip arrays, they satisfy three core demands including process protection, temporary support and function enhancement, serving as pivotal equipment linking wafer processing and packaging forming in advanced packaging production lines.
Bidding Agency:China CNTC International Tendering Corporation
Purchasers:Shanghai Xinyuan Innovation Center
Open-Time of Bids:2026-07-01 09:30
Ending Date of Evaluation Result:2026-07-08 23:59
Who proposed the successful bidder:
| rank | Proposed Bid-winner | Manufacturer | Manufacturer Country |
|---|---|---|---|
| 1 | Yunzhe Semiconductor Technology (Zhejiang) Co., Ltd | Yunzhe Semiconductor Technology (Zhejiang) Co., Ltd. | China |
