Bidding NO :0618-264TC260709D
Bidding Content:On semiconductor manufacturing and advanced packaging production lines, thermal debonders are used to safely and flawlessly separate ultra-thin wafers that have completed backside processes from temporary carriers. They monitor and regulate key parameters such as heating temperature, separation parallelism and speed, enabling high-yield debonding processes and ensuring the integrity of thin wafers as well as the reliability of subsequent procedures in advanced technologies including fan-out packaging.
Bidding Agency:China CNTC International Tendering Corporation
Purchasers:Shanghai Xinyuan Innovation Center
Open-Time of Bids:2026-07-01 09:30
Ending Date of Evaluation Result:2026-07-08 23:59
Who proposed the successful bidder:
| rank | Proposed Bid-winner | Manufacturer | Manufacturer Country |
|---|---|---|---|
| 1 | Extripod Electronics Technology Limited | ERS Electronic GmbH | Germany |
